As the global demand for high-performance electronic devices continues to surge, the importance of quality and reliability in microelectronics cannot be overstated. These two pillars are critical to the longevity and performance of electronic components, which are foundational to a wide range of industries. This October, IMAPS Germany will once again host its annual conference, providing a vital platform for industry and academia to exchange knowledge on the latest advancements in microelectronic packaging. Mark your calendars for October 17-18, 2024, and join us at the Hochschule München for an engaging and informative event.
Quality and Reliability in Focus
The IMAPS Herbstkonferenz 2024 will delve into several key areas essential to ensuring the quality and reliability of microelectronic devices:
Process Monitoring and Test Strategies
Effective process monitoring and robust test strategies are crucial in identifying and mitigating defects early in the manufacturing cycle. This segment will explore the latest methodologies and tools designed to enhance precision and efficiency in detecting faults, ultimately ensuring higher product reliability.
Testing Systems
Modern testing systems are crucial for ensuring electronic components meet rigorous quality standards. Attendees will learn about innovative testing solutions that provide comprehensive insights into the performance and durability of microelectronic assemblies.
Thermomechanical Reliability
Understanding and improving thermomechanical reliability is vital, particularly as devices become smaller and more complex. This topic will cover the latest research and solutions aimed at addressing the challenges posed by thermal and mechanical stresses, which can significantly impact device performance and lifespan.
Reliability Under Combined Stresses
Microelectronic devices often operate under combined electrical, thermal, and mechanical stresses. Discussions will focus on strategies to predict and enhance reliability in these demanding environments, ensuring that devices can withstand multifaceted operational stresses.
Lifetime Monitoring and Prediction
Accurate lifetime monitoring and prediction are key to preventing unexpected failures and extending the operational life of electronic components. This session will highlight cutting-edge techniques and models used to forecast device longevity and preemptively address potential issues.
Event Details
Date: October 17-18, 2024
Venue: Hochschule München
IMAPS Germany’s annual conference is recognized as a cornerstone for fostering in-depth technical discussions between industry leaders, academic experts, and researchers. This year’s event will feature presentations on a variety of microelectronic packaging topics, offering valuable insights and fostering collaboration.
Meet Our Experts
Representatives Dana Kaufmann and Florian Ottl will be on-site to share their expertise. They will be presenting on the critical topic of semiconductors, showcasing the latest trends and innovations in this pivotal area of microelectronics.
Join the Conversation
We warmly invite you to present your findings and engage in discussions with peers from the industry and academic spheres. Presentations will be 20 minutes long and followed by a discussion session, and participants are encouraged to share their slides with attendees. Take advantage of this excellent opportunity to contribute to the advancement of the microelectronics field and to gain feedback from esteemed colleagues.
For more information and to register, please visit the IMAPS Herbstkonferenz 2024 website.
Ensure your place at the forefront of microelectronics innovation—join us at the IMAPS Herbstkonferenz 2024!
More articles
Trapped in Ice
Arctic ice is disappearing — the question is how fast. Summer sea ice could endure 100 more years, or it could vanish later this decade, with disastrous consequences for the rest of the planet. To nail down the answer, an expedition to the top of the world has to uncover the complex physics of ice.
Read more...Introducing License Flexibility: GI.bench’s Latest Update Adds Dongle Support
We are excited to announce the newest enhancement to GI.bench. With the introduction of License-Dongle support and several minor improvements, GI.bench continues to evolve with functionality that anticipates and meets the evolving needs of professionals in the field.
Read more...Gantner Instruments at Aero Engine Testing 2025
On March 20–21, 2025, aerospace professionals, industry experts, and technology providers will gather in Mianyang for the 2025 Aerospace Equipment Digital Intelligence Test and Industry Development Conference. Under the theme “Digital Leadership in Aviation, Intelligent in the Blue Sky,” this event highlights cutting-edge progress in advanced aircraft engine digital intelligent testing, high-precision measurement, combustion, turbine, and strength testing. One main forum and five sub-forums will feature experts sharing insights and best practices, while an aircraft engine test technological achievements and product exhibition showcases the latest innovations.
Read more...